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Hot Pressed Silicon Carbide and Aluminum Oxide Ceramics

Special grades of high density hot pressed silicon carbide and aluminum oxide are available in very large sizes. These materials are suitable for both electronic and structural applications. They are extensively used in key parts of popular machines used for etching of silicon wafers.

Physical Properties Si:Carb Al:Ox Si:Nite Al:Nite





Material SiC Al203 Si3N4 AlN





Average Grain Size 4.0um 0.80um 0.50um 2.5um





Weibull Modulus 18 m 12 m 9 m 15 m





Elastic Modulus 455 GPa 393 GPa 310 GPa 330 GPa





Fracture Toughness 5.2 MPa·m½ 4.8 MPa·m½ 5.7 MPa·m½ 2.4 MPa·m½





Thermal Coductivity 155 W/mk 39 W/mk 30.0 W/mk 100.0 W/mk





Coef. of Thermal Expansion 4.5 x 10 -6/C° 8.4 x 10 -6/C° 3.3 x 10 -6/C° 5.0 x 10 -6/C°





Density 3.20 gm/cm³ 3.93 gm/cm³ 3.18 gm/cm³ 3.25 gm/cm³





Hardness 2700 (knoop) kg/mm² 1070 (knoop) kg/mm² 1560 (knoop) kg/mm² 1070 (knoop) kg/mm²





Flexural Strength (MOR) 655 MPa 689 MPa 640 MPa 428 MPa





Poissons ration 0.14 0.22 0.27 0.25





Applications: Fixtures and parts for etching machines for silicon wafers.

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Update 03.01.02
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