4750 Magnolia Street
Port Townsend, WA 98368
Tel: 360-379-6707
Toll Free: 877-452-4910
Fax: 360-379-6907
[email protected]
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Hot Pressed Silicon Carbide and Aluminum Oxide Ceramics
Special grades of high density hot pressed silicon carbide and aluminum oxide are available in very large sizes. These materials are suitable for both electronic and structural applications. They are extensively used in key parts of popular machines used for etching of silicon wafers.
Physical Properties |
Si:Carb |
Al:Ox |
Si:Nite |
Al:Nite |
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Material |
SiC |
Al203 |
Si3N4 |
AlN |
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Average Grain Size |
4.0um |
0.80um |
0.50um |
2.5um |
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Weibull Modulus |
18 m |
12 m |
9 m |
15 m |
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Elastic Modulus |
455 GPa |
393 GPa |
310 GPa |
330 GPa |
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Fracture Toughness |
5.2 MPa·m½ |
4.8 MPa·m½ |
5.7 MPa·m½ |
2.4 MPa·m½ |
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Thermal Coductivity |
155 W/mk |
39 W/mk |
30.0 W/mk |
100.0 W/mk |
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Coef. of Thermal Expansion |
4.5 x 10 -6/C° |
8.4 x 10 -6/C° |
3.3 x 10 -6/C° |
5.0 x 10 -6/C° |
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Density |
3.20 gm/cm³ |
3.93 gm/cm³ |
3.18 gm/cm³ |
3.25 gm/cm³ |
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Hardness |
2700 (knoop) kg/mm² |
1070 (knoop) kg/mm² |
1560 (knoop) kg/mm² |
1070 (knoop) kg/mm² |
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Flexural Strength (MOR) |
655 MPa |
689 MPa |
640 MPa |
428 MPa |
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Poissons ration |
0.14 |
0.22 |
0.27 |
0.25 |
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Applications: Fixtures and parts for etching machines for silicon wafers.
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