Aluminum Nitride
Aluminum Nitride Products
Aluminium Nitride products have superior thermal conductivity, high electric insulation, and coefficient of thermal expansion similar to that of silicon (Si).
- High thermal conductivity about 7 times that of Alumina
- Having coefficient of thermal expansion similar to that of silicon, it realizes a high reliability against installation of a large Sichip and heat cycle
- High electric insulation, and low dielectric constant
- Mechanical strength higher than that of Alumina
- Superior corrosion resistance against molten metal
- Very small content of impurities, no toxicity, high purity.
Physical properties (principal values)
Characteristic value |
Unit |
Sheet formed product | Press molded product | |
Density |
g/cm3
|
33 | 3.3 | |
Thermal conductivty |
W/m•k (R.T.) |
170 | 160 | |
Coefficient of thermal expansion | x10-6/ºC (R.T.~400ºC) | 4.6 | 4.6 | |
Dielectric strength | KV/mm (R.T.) | 15 | 15 | |
Volume resistivity | Ω•cm (R. T.) | 1014 | 1014 | |
Dielectric constant | 1MHz (R.T.) | 9.0 | 9.0 | |
Bending strength | MPa (R.T.) | 450 | 300 |
Board, general tolerance |
||
Item | Sheet formed product | Press molded product |
Dimension | Max. 5"x7" | Max. 2"x2" |
Thickness | 0.5~1.5 (as fired) 0.3~1.0 (lapped) | 1~8 mm |
Dimensional tolerance | ±1%NLT ±0.1 mm | ±1%NLT ±0.1 mm |
Warp tolerance ** | ≤0.003mm/mm | ≤0.003mm/mm |
*Thickness tolerance of both-side polished product : ±0.05 mm
** Warp of both-sided polished product: ±0.0015 mm/mm |
Thermal Conductivity
Coefficient of thermal expansion
Characteristic value | Unit | Sheet formed product | Press molded product |
Density | g/cm3 | 3.3 | 3.3 |
Thermal conductivity | W/m•k (R.T.) | 170 | 160 |
Coefficient of thermal expansion | x10-6/ºC (R.T.~400ºC) | 4.6 | 4.6 |
Dielectric strength |
KV/mm (R.T.)
|
15 | 15 |
Volume resistivity | Ω•cm (R. T.) | 1014 | 1014 |
Application
- Power transistor module board
- High-frequency device boar
- Radiating/insulating plate for thyristor
- Mount board for semiconductor laser and light emission diode
- Hybrid module, ignition module
- IC package
- Thermo-module board
- Parts of semiconductor manufacturing equipment